Samtec Announces Release of New VITA 74 VNX Compliant Products
Rainbow Technology Systems to Showcase Biosensor Capability
Tracealyzer 4 now supports Micrium µC/OS-III and Arm ITM Tracing
Coilcraft Introduces XEL50xx Ultra Low-loss Power Inductors for High-frequency Applications
Mouser Electronics New Product Insider: April 2018
Avalue Announces Type 6 Computer-on-Module (COM) Express Compact Module, ESM-APLC and ESM-KBLU
Avnet and Sigfox Drive Innovation
Broadband Forum brings IoT home with new USP standard
EM Microelectronic enables green IoT with revolutionary ultra-low-power precision Real-Time-Clock
EMTELLE Completes DATA Center Portfolio with launch of New end-to-end Solution
Mouser Electronics New Product Insider: March 2018
Mouser Electronics, Inc. specializes in the rapid introduction of new products and technologies. As the industry leader in New Product Introductions (NPIs), Mouser makes it a priority to stock the newest products and technologies from our 700+ manufacturer partners, giving customers an edge and helping speed time to market. February 2018 Product Insider Last month, Mouser launched more than 215 new products ready for same-day shipment. Some of the products introduced by Mouser last month include: Maxim Integrated MAX12900 Sensor Transmitter AFE The Maxim MAX12900 is a highly integrated, ultra-low-power 4 mA – 20 mA sensor transmitter that offers space savings of more than 20 percent and power savings up to 50 percent. Molex Sealed FAKRA RF Connectors Molex FAKRA RF Connectors offer a sealed, inline solution for automotive cameras, radio antenna, keyless entry or any application requiring an IP69K rating, along with mechanical key feature and color coding to ensure a proper connection. NXP Semiconductors i.MX 8M Quad Evaluation Kit The NXP i.MX 8M Quad evaluation kit offers industry-leading audio and video capabilities for developing flexible, high-performance applications based on the i.MX 8M Quad, i.MX 8M Dual, and i.MX 8M QuadLite applications processors. InvenSense ICM-20789 7-Axis Inertial and Barometric Pressure Sensor The InvenSense ICM-20789, the industry's first 7-axis inertial and barometric pressure sensor, combines a 3-axis gyroscope, 3-axis accelerometer, Digital Motion Processor™ (DMP), and an ultra-low-noise MEMS capacitive barometric pressure sensor.
HUBER+SUHNER serves up cost-saving solution in RF-energy applications
Leading international manufacturer of components and systems for optical and electrical connectivity, HUBER+SUHNER, is showcasing its smart concept solutions which offer increased power and lower running costs to RF-energy applications at the third Electronic Design Innovation Conference (EDI CON), in China, March 20-22. Speaking today, Hannes Grubinger, Market Manager at HUBER+SUHNER, addressed the current challenges within the RF Energy market and highlighted the solutions which the company can offer to tackle these problems. “Connectors and cables used in the communication industry today are often not the best-placed solution for RF-energy appliances. The losses and cost of coaxial assemblies are not appropriate for the applications in the respective markets, including cooking and warming, industrial, medical and automotive applications,” said Grubinger. “Using solid-state generated and amplified RF-power brings a completely new user experience due to the improved controllability of amplifiers compared to magnetrons.” Grubinger emphasised having the right RF-connectivity is key to the future success of solid-state RF-based systems and stressed the need to provide a solution that overcomes mechanical stress between building blocks. According to Grubinger, a good RF-Energy connector solution needs to allow mounting with relative relaxed mechanical tolerances but must also provide an excellent electrical performance. Reaching the industries’ cost targets are another important detail. He said: “The new HUBER+SUHNER RFEX connector has been developed to further integrate the RF-output connector into the housing of amplifiers used in RF-Energy. This reduces costs and maximises RF-performance. Features such as blind mateability and reduced mechanical stress, as known in HUBER+SUHNER MMBX, MFBX and MBX connectors, have also been implemented into the HUBER+SUHNER RFEX.” The HUBER+SUHNER RFEX technology is designed for direct connection with dielectric-filled waveguides, rectangular waveguides or the appliance. This means that the antenna structure is part of the connector and can be implemented according to the customer’s needs. RFEX is designed for production of very high volumes, not only supporting the need of low component cost, but also supporting simplification of amplifier and appliance assembly processes. Grubinger also drew attention to the idea that while distributing the RF-Energy by waveguides is common practice and a cost-effective method, dielectric-filled waveguides in complex applications may further reduce size and cost, allowing for higher installation flexibility. Since dielectric-filled waveguides are extruded, they can be manufactured in any length and format needed, providing significantly higher flexibility for application designers. “Our breakthrough in alternative connectivity shows that many unsolved issues can now be solved by connecting solid-state RF-amplifiers with the new HUBER+SUHNER RF-connector solutions. The solutions contribute to higher achieving and performing appliances, cost benefits, and can be utilised for commercial solid-state energy use in the future,” concluded Grubinger. Hannes Grubinger’s presentation is titled “RF-Energy-Connectivity, addressing the requirements of the future applications” and will take place at 12:05pm on March 20th. In addition to this, he will contribute to an RF-Energy panel session on March 22nd, “Solid State RF-Energy – Inroads to the Industrial Market, Panel Discussion” at 09:05am. The third annual EDI CON is taking place 20-22 March 2018 at the China National Convention Centre, Beijing, China. For more information see http://www.ediconchina.com/
EM Microelectronic's em|echo breaks new ground as the world's first EPC Gen2v2-certified product
EM Microelectronic, the ultra-low-power semiconductor company of the Swatch Group, and a leading technology provider for connected objects, today announced that its flagship RAINFC product em|echo is the first product to achieve EPC Gen2v2 certification worldwide. The EPC Gen2v2 standard integrates the latest security and privacy features, addressing the challenges of today's connected world and the pervasiveness of RFID communication. The increasing consumer awareness about the sensitivity of their data and exposure to tracking is driving a growing demand for RFID installations to guarantee their privacy. Following of a collective industry effort to standardize these functionalities, the EPC Gen2v2 certification provides the brands and retailers a complete toolbox for achieving this goal. EM has been a pioneer in the UHF RFID space, better known today as RAIN RFID, leading the world's first massive deployments in retail. Leveraging this signature Swiss technology-pioneering spirit, em|echo moves the bar higher, by blending the powerful traceability features of RAIN into the convenient NFC consumer interaction to yield RAINFC. This groundbreaking EPC Gen2v2 certification is one more step in this journey towards Augmented RFID, a new reality in which objects become smarter and interact not only amongst them, but also directly with the user and their environment, thanks to a wide array of sensing capabilities. Further information about the EPC Gen2v2 certification is available here: https://www.gs1.org/hardware-certification-program#p4 To learn more about em|echo, RAINFC and augmented RFID visit us at RFID Journal Live! Booth #1319
ARM Tech Symposia 2017 Press Conference
ARM, a UK semiconductor intellectual property (IP) company, held an ARM Tech Symposia 2017 press conference at InterContinental Seoul COEX Hotel, on November 28th, 2017, and introduced updates including the innovation of Mbed Cloud solution, IoT security and Mobile Display IP. Innovations of ‘Mbed Cloud’ solution were based on IoT security solutions, presented by Nandan Nayampally, Director of ARM Client Computing Division, and mobile display IP, presented by Roger Barker, Director of Multimedia Product Marketing, ARM Client Division. ▲ Nandan Nayampally, Director of ARM Client Computing Division ▲ ARM has proposed 'PSA' as a security system for its entire IP. Mbed Cloud's device management capabilities are expanded. With the introduction of Mbed Edge, Mbed Cloud is now able to mount, control and manage devices via IoT gateway. As a bridge between local wired and wireless devices and the cloud, Gateway plays a very important role in the IoT network and, in most cases, drives local applications for device control. Failure of the gateway can have a catastrophic effect on local operations, such as a stoppage of production lines or interruption of wind farms. Having the additional functions of Mbed Edge, the Mbed Cloud offers three new features, including Internet Protocol (IP) and legacy-connected device connectivity and management, gateway management and diagnostics, and edge computing. (1) Protocol translation: Many legacy devices are connected via IP-incompatible communication protocols such as Modbus and BACnet. Mbed Edge converts these protocols to IP, allowing non-IP devices to connect to Mbed Cloud and to manage with other IP-connected devices. (2) Gateway management: Mbed Edge provides new features to improve resiliency of IoT gateways and minimize damage by downtime. The key features include alarm notification, process, resource, interface management, and detailed diagnostics. (3) Edge compute: Mbed Edge provides an execution environment for local application, and the gateway computes resources to process its own rules and data. It also minimizes productivity degradation by allowing the gateway to take independent actions when the cloud connection is lost. ▲ Roger Barker, Director of Multimedia Product Marketing, ARM Client Division ▲ MALI-D71, a chip that integrates new technologies to meet recent demand such as HDR and VR ▲ CoreLink MMU-600 chip has emerged to support features such as copyright protection and high performance. Mbed Edge extends the device management solution of Mbed Cloud to include existing non-IP connected devices. It also allows IoT to be deployed on the edge, provides management function to diagnose problems at the field, and quickly resolve hardware errors. Mbed Edge gives Mbed Cloud customers the opportunity to expand their IoT networks to handle a new range of endpoints, thereby giving them the ability to present new services. Meanwhile, Arm has an ecosystem of more than 100 billion Arm-based devices shipped as well as the most common computing solutions for IoT, which dramatically expands device management capabilities, enabling consumers to meet their needs for secure IoT device lifecycle management. Arm has been pre-commercialized with selected customers and partners, and now Mbed Cloud is available to all customers and partners. In addition, the protocol conversion feature of Mbed Edge is available as a preview.
Coilcraft to Announce New High-voltage Coupled Inductors at APEC 2018
Coilcraft will debut its new LPD8035V Series of miniature, high-voltage 1:1 coupled inductors at the Applied Power Electronics Conference (APEC) being held March 4-8 in San Antonio, Texas. The LPD8035V provides 1500 Vrms, one-minute isolation (hipot) between windings from a package that measures just 7.92 X 6.4 X 3.5 mm, providing users with significant size and cost reductions over conventional bobbin-wound alternatives. It is ideal for Flyback, SEPIC and isolated-Buck converter designs. The LPD8035V Series is currently offered in six inductance values ranging from 4.7 to 150 µH. It provides peak current ratings up to 2.7 Amps, which represents a 40% increase over previous generation products. It also has a tight coupling coefficient (≥0.97). LPD8035V coupled inductors are qualified to AEC-Q200 Grade 3 standards (-40° to +85°C ambient), making them suitable for automotive and other high-temperature applications. They feature RoHS compliant matte tin over silver-platinum-glass frit terminations and are halogen free. Like all Coilcraft products, complete technical specifications and free evaluation samples of the LPD8035V Series are available online at www.coilcraft.com. For more information, contact Len Crane, +1-847-639-6400, email@example.com or visit Coilcraft in booth 719 at the Applied Power Electronics Conference.
Mouser Electronics New Product Insider: February 2018
Mouser Electronics, Inc. specializes in the rapid introduction of new products and technologies. As the industry leader in New Product Introductions (NPIs), Mouser makes it a priority to stock the newest products and technologies from our 700+ manufacturer partners, giving customers an edge and helping speed time to market. Linear Technology In 2017, Mouser launched a total of 3,860 new products. Last month, Mouser launched more than 229 new products ready for same-day shipment. Some of the products introduced by Mouser last month include: Intel® Compute Card Intel Compute Card is a modular compute platform that brings the power of computing and connectivity to virtually any product, anywhere. Amphenol RADSOK® Power Bus Amphe-PD™ Connector Series The Amphenol Industrial Amphe-PD series connection system features RADSOK technology for higher amperage, lower t-rise, less resistance and lower mating forces in wire-to-wire, wire-to-board, and busbar terminations. Texas Instruments CC3220MOD SimpleLink™ Wireless Microcontroller Modules Created for the Internet of Things, TI's CC3220MOD modules integrate two physically separated on-chip microcontrollers: an Arm® Cortex®-M4 application processor and a network processor to run all Wi-Fi and internet logical layers. Microsemi PolarFire® FPGA Splash Kit The Microsemi PolarFire Splash Kit is a cost-optimized kit that allows designers to evaluate the basic features of the award-winning low-power, mid-range PolarFire FPGA product family. To see more of the New Product Insider highlights, go to www.mouser.com/newproductinsider. With its broad product line and unsurpassed customer service, Mouser strives to empower innovation among design engineers and buyers by delivering advanced technologies. Mouser stocks the world's widest selection of the latest semiconductors and electronic components for the newest design projects. Mouser Electronics' website is continually updated and offers advanced search methods to help customers quickly locate inventory. Mouser.com also houses data sheets, supplier-specific reference designs, application notes, technical design information, and engineering tools.
Ethernet Live Monitor by RUETZ SYSTEM SOLUTIONS Optimizes Error Analysis in Real Time
experts in automotive data communications – present the new Ethernet Live Monitor (ELM) for intelligent and efficient error analysis of data transports in automotive networks. "The enormous amount of audio and video data (A/V) challenges data monitoring systems, with the result that loggers do not monitor permanently and thus only analyze audible and visible errors," explained Wolfgang Malek, General Manager and Co-Founder of RUETZ SYSTEM SOLUTIONS. "With the Ethernet Live Monitor, we close the gap and do complete, live monitoring of Ethernet traffic." Once the Ethernet Live Monitor detects an irregularity it triggers the data logger, initiating the recording of relevant data. It is available in two versions. The Ethernet Live Monitor 1000BASE-T uses an external Ethernet TAP (Terminal Access Point) that timestamps the hardware-related packages. The Ethernet Live Monitor 100BASE-T1 has this TAP already implemented. For configuration and display, test engineers simply require a PC. The Live Monitor can easily be integrated in existing test systems or test vehicles for in-system diagnosis of AVB/TSN. Live Testing with Intelligent Data Management The Ethernet Live Monitor detects errors in the live stream by means of the various complex test algorithms. It then triggers the data logger in order to record the relevant data. It automatically identifies irregularities and non-audible and non-visible errors. In addition, it sends an error description to the data logger and stores it with the filed traces for subsequent, effective error analysis. During the following analysis, test engineers already know what issue and time stamp to look for. In addition, data loggers have to provide less storage space. The Ethernet Live Monitor scans data frames directly on the bus without influencing the original network. Thus, RUETZ SYSTEM SOLUTIONS provides intelligent data management: only truly relevant data is recorded and errors are reported to the corresponding log file. It contains more than 40 complex test algorithms for IEEE 802.1AS, 1722/1722a, which can be expanded by costumer-specific test algorithms. In addition, it offers low power input, a robust body, passive cooling, and EMC-proof aluminum housing. Consequently, it perfectly qualifies for vehicle testing. A separate offline analysis tool is also available.
Avalue presents the latest cutting-edge IoT solutions for manufacturing, healthcare and signage at Embedded World 2018
March 1 at the Nuremberg Exhibition Center, Avalue will showcase the embedded platforms with latest Intel generation platforms in a wide variety of markets, and the IoT based solutions include cloud-based smart diagnosis for CBM, wireless pick-to-light solution, and HDbaseT long distance solution etc. for smart industry, healthcare and signage applications. Highlights: Open frame tablets comprise the latest Intel® processors, and also unveil the latest embedded board series, Mini ITX, 3.5-inch Boards etc., fanless tiny systems, slot PC, and panel pc with programmable LED light bar. Welcome to explore our Booth in Hall 3, 3-549 to experience Avalue IoT world Visit us to learn more how Avalue innovations for smart IoT solutions with the latest technology and service that boost and contribute our customers’ business growth. - Open frame tablet series for different embedded applications Open Frame Tablet series are powered by Intel® BayTrail-T/CR Z3735F Quad Core and CPU, along with flat screen with PCAP touch gives user fast and sensitive touch response, WiFi (802.11B/G/N) & Bluetooth 4.0 to meet demands of wireless connection, multi OS compatibility with Windows, Linux and Android allow customers to integrate their existing system easily. - Pick-to-Light Solution Avalue pick-to-light is the fastest operator-based picking solution that was designed with E ink display and Tri-color illumination that not only reduce the electricity, but increase the speed and accuracy of their piece picking operations. There are some features which we can learn the solution how to increase the pick rate productivity. After market installed solution E Ink Display with Platanus® Sub-GHz ISM Band Tri-color illumination for sequential order picking Ultra-low power protocol tuned to optimize the battery life and data transferring - Smart Manufacturing - The expert in the data diagnosis through the acoustic/vibration A complete smart manufacturing solution included the sensor, the IoT Gateway, DAQ and the software, which brings you the intelligent experience. Just a few steps to install in field easily, which turns the complicated problems into simple and clear issues. It is able to help you make the maintenance decision. Smart diagnosis for CBM features: Microsoft Azure Certified IoT Device IP65 Rating and Wide Temperature Box PC, design for the harsh environment Multiple communication interfaces include Wi-Fi, LTE, DAQ, Ethernet Programmable LEDs for Status Indication
Samtec's EXTreme Ten60Power System Available with Higher Density and AC Power Options
Samtec has released a higher density signal count and new AC power option available with the EXTreme Ten60Power™ system. TSamtec's EXTreme Ten60Power™ header and socket system (ET60T/ET60S Series) is available in both power/signal combinations and power only for increased design flexibility. The new 5-row signal option allows for up to 40 positions in the same form factor as the 3-row option. For higher density without the need for additional space, the 5-row design features a 2.00 mm pitch, versus the 3-row on a 2.54 mm pitch. The new AC power option provides greater flexibility to this modular EXTreme Ten60Power™ system, which is configurable to meet most application specifications. AC power blades feature a 7.50 mm pitch to accommodate higher voltage levels, while DC power blades are on a 5.50 mm pitch to carry a lower, more constant voltage level. Additionally, the power blades can be selectively loaded to achieve any specific creepage and clearance requirements. The EXTreme Ten60Power™ family delivers high current power performance to 60 A per power blade with a low 10 mm profile design for enhanced system flow. Symmetrical or asymmetrical power configurations are available, as well as AC and DC combinations. A split power option is in development. This system features a hot swap option and is rated for a maximum voltage of 250 V. The through-hole, right angle terminal and socket are ideal for coplanar applications. The socket also is available in a vertical orientation for perpendicular mating and optional press-fit tails for ease of board termination. Rugged guide posts are standard and assist in blind mating. A top guide post is in development for additional board space savings. Samtec's line of power products includes PowerStrip™ available in three product levels differentiated by size and power output: PowerStrip™/35, PowerStrip™/25 and PowerStrip™/15. In addition, the PowerStrip™ family includes power and power/signal combination discrete wire cable systems, power and power/signal combinations in right-angle and vertical orientations, as well as a hinged system and press-fit termination for board level applications. Please visit Samtec's EXTreme Ten60Power™ web page for more information about EXTreme Ten60Power™ products, or try the parametric search in Samtec's online Solutionator® tool to find products that meet specific creepage and clearance specifications.
Percepio announces Tracealyzer 4 with new user interface, custom analysis and live views
Percepio AB, the Swedish developer of RTOS visualization tools, announces a major update of Tracealyzer, its industry-leading tool for visual software tracing of RTOS-based embedded systems and IoT devices. Tracealyzer version 4 has been redesigned from the bottom up, spanning from much faster data processing to a fresh modern user interface with live visualization. It also sports a host of new features aimed at empowering embedded developers and enabling them to get their products to market faster with fewer bugs. "This is the largest update of Tracealyzer ever, with a lot of new analysis and visualization features that users have been asking for. After mainly focusing on broad RTOS support, this marks the beginning of a new phase featuring more powerful, user-defined analysis. It's a greater value for a greater number of developers. Tracealyzer 4 is a whole new experience and a very powerful tool for embedded software developers," says Dr. Johan Kraft, Percepio founder and CEO. Some of the groundbreaking new features are Unlimited tracing Monitor your application over long test runs, spanning hours, days or even weeks, and see analysis results, such as task execution times, immediately. Find interesting spots in the new trace preview and drill down into the details using the full power of Tracealyzer. Advanced live visualization View the trace live while recording. Pause individual views to zoom in and inspect details while recording continues in the background. This way you can spot issues in the trace directly as they occur. Network and I/O awareness Tracealyzer 4 provides better support for tracing Internet-of-Things devices and other connected applications with new awareness of network and I/O events. This allows for visualizing communication data rates over time, as well as the runtime interactions between tasks and communication interfaces like TCP sockets. User-defined analysis Adapt Tracealyzer to your specific use case and see what really matters to you. Tracealyzer 4 allows you to define custom intervals that highlight and report the time between selected software events. Moreover, with user-defined state machines you can visualize any state information in the trace, from software state variables or logged hardware states, either as state transition graphs or shown on a time line, much like in a logic analyzer. Tracealyzer version 4 will be on display in Percepio’s booth 4-305 at Embedded World in Nuremberg next week. It will then be generally available in early March for Keil RTX5, FreeRTOS and Amazon FreeRTOS. Support for other RTOSs will be added during the first half of 2018; see https://percepio.com/tracealyzer for details. Licenses start at USD 1,695/EUR 1,395, see https://percepio.com/licensing Existing Tracealyzer customers are offered a discounted upgrade, starting at USD 495/EUR 395.
Faultless data transfer despite interference - digitally tunable radio frequency filters at embedded world
With the available frequencies increasingly used up, the communication industry faces some big challenges: Demand is growing for wireless communication systems that work faultlessly even when coexistence and interference problems arise. The Fraunhofer Institute for Integrated Circuits IIS has developed digitally tunable radio frequency filters (RF filters) that provide dynamic access to a variety of frequencies without any delay. Fraunhofer IIS will be presenting its RF filters at embedded world 2018. Wireless communication systems are used wherever wired solutions are impractical or when full flexibility is a must. Applications in areas such as satellite communication, public safety and mobile communication employ wireless communication as a matter of course. Wireless technologies are, however, also fast becoming a staple of industry as a way of increasing process connectivity and flexibility. Whatever the application and context, the devices that send and receive data must function reliably. But with coexistence and interference issues on the rise, we can expect significant constraints and problems when it comes to transferring data. Fraunhofer IIS has developed digitally tunable radio frequency bandpass filters that make it possible to reliably select the required frequency spectrum while simultaneously rejecting out-of-band signals. Digital adjustability and the option of reconfiguring filters during operation enable dynamic access to a variety of frequencies without delay. This provides a quick and easy way of making country- and application-specific adjustments. Compared to conventional filter banks that comprise multiple filters, the solderable RF filters are a space-saving solution, each one measuring just 14 x 15 mm. RF filters at embedded world : To learn more about the advantages of using the various types of bandpass filters available for frequencies from 220 to 1400 MHz, visit the Fraunhofer IIS booth at embedded world (Hall 4, Booth 4-460) in Nuremberg from February 27 to March 1, 2018.
Percepio and Cypress debuts Tracealyzer support for Cypress PSoC 6
Percepio announces Tracealyzer support for Cypress’ most recent MCU family PSoC® 6, allowing embedded IoT developers to visualize RTOS software behavior together with hardware activity in the industry-leading trace visualization tool. This leverages Cypress’ innovative hardware profiler unit integrated in the PSoC 6 MCU, which allows for monitoring the activity level of 27 hardware functions such as BLE radio, Flash memory and DMA channels. “Percepio Tracealyzer provides advanced RTOS debugging features that our customers need,” said Jim Davis, MCU Marketing Director at Cypress. “Combined with our PSoC 6 ultra-low-power IoT MCU, customers now have the capability to quickly get their products to market and reduce expensive design-cycles.” Percepio founder and CEO Dr. Johan Kraft comments “By using Cypress PSoC 6 MCUs and Percepio Tracealyzer, embedded IoT developers gets superb insight into the system-level behavior at runtime, including both software and hardware activity in a single, comprehensive tool. This makes debugging a lot easier and provides much better means for optimization of performance and energy consumption.” To help Cypress PSoC developers get started with Tracealyzer, Percepio and Cypress have collaborated to produce an Application Note with specific instructions for PSoC® 6 MCUs and PSoC Creator. It is available from the Percepio website at https://percepio.com/tracealyzer-psoc. A live demo of the Tracealyzer support for Cypress PSoC® 6 will be on display in Cypress’ booth at Embedded World 2018 in Nuremberg, Germany, Feb 27 - Mar 1.
EMTELLE Launches Indoor Pre-connectorised FIBRE Microduct system
Emtelle, a leading provider of blown fibre and ducted network solutions for the telecoms industry, today launched a ground-breaking new product to meet new indoor fire regulations. Based on the QWKconnect pre-connectorised fibre microduct system, the new QWKconnect MDU is manufactured out of Low Fire Hazard (LFH) material, meaning it is suitable for internal use, giving excellent performance in a fire scenario. The QWKconnect MDU uses QWKlink Fibre from the Emtelle FibreFlow brand, but comes pre-installed in a LFH microduct, and has the added benefit of pre-installed fibre connectors on both ends, eliminating the need to splice or blow fibres for FTTX drop applications. The QWKconnect MDU fibres 1.1mm diameter reduces the cost and complexity of installation and works by simply plugging in once installed. “QWKconnect MDU allows us to offer our customers the most-up-to-date technology in terms of both cost-efficiency and industry regulations,” said Scott Modha, International Business Development Manager at Emtelle. “Our popular QWKconnect is proven in the benefits it offers to our customers and now we can offer an extra dimension to this through the fully LFH, versatile QWKconnect MDU for internal use.” The QWKconnect MDU can be installed from the basement, up the riser and connected to a simple termination box within the premise or apartment. The product also gives a future-proof, dedicated microduct pathway to each apartment to allow for future upgrades of the fibre. “There is no other product on the market which provides such savings for an internal or ducted FTTH drop solution when quality needs to be high and installation needs to be cost-effective, simple and reliable. You simply ‘Fit and Forget,’” said Mark Graham, Technical Engineer at Emtelle. “We are looking forward to showcasing this product for the first time at the FTTH Conference.” The QWKconnect MDU will be just one of the products to be showcased by Emtelle at the FTTH Conference 2018, which takes place from tomorrow in Valencia. Visitors to Emtelle’s stand G01 will also be invited to take part in a ‘Blown Fibre Race’ which will demonstrate FiSpy by FiComms, for which Emtelle has become the premier distributor in Europe. The Blown Fibre Race winner will be presented with a FiSpy on the final day of the conference. Emtelle’s International Business Development Manager Scott Modha will also discuss how to improve the speed and efficiency of MDU installations for FTTH, even where fibre resources are limited, in the FTTH Conference Workshops on Tuesday, February 13 from 2pm to 5pm.
The Xilinx Zynq UltraScale+ SoC module under any circumstances
With the Mercury+ XU1, Enclustra presents at Embedded World 2018 in Nuremberg at booth 3-210 its fastest SoC module based on the Xilinx Zynq UltraScale+ MPSoC. It accommodates 6 ARM cores, a Mali 400MP2 GPU, up to 4 GB of extremely fast DDR4 ECC SDRAM, numerous standard interfaces, 294 user I/Os and up to 747,000 LUT4 equivalents - all on an area smaller than a credit card. - Mercury+ XU1 With the Mercury+ XU1, FPGA specialists Enclustra offer a quick and easy way into the Xilinx Zynq UltraScale+ MPSoC ecosystem. In addition to up to 747,000 systems logic cells across 6 ARM processors, the Mercury+ XU1 also possesses a GPU and up to 294 user I/Os. Built-in interfaces include two Gigabit Ethernet, USB 3.0 and USB 2.0, sixteen MGTs (with speeds of up to 12.5 Gbps), as well as PCIe Gen2 x4. With up to 4 GB of DDR4 SDRAM with bandwidths of 19.2 GByte/s and ECC, as well as 16 GB eMMC flash memory, the Mercury+ XU1 is supremely equipped to handle even the heaviest of resource-hogging applications, despite having a footprint of just 74 × 54 mm. The module is available in both commercial and industrial temperature ranges, and needs just a single 5-15 V supply for operation. - Reference design and Linux at the push of a button Enclustra offers a broad design-in support for their products. With the Mercury+ PE1-300 or Mercury+ PE1-400 baseboards, the Mercury+ XU1 can be a powerful development and prototyping platform. Further expansion options are provided by the LPC/HPC FMC connectors on the PE1 base board, compatible with a huge range of plug-in cards from various manufacturers - ADCs, DACs, motor control cards and RF links are just a small selection of possibilities. Enclustra also offers a comprehensive ecosystem for the XU1, offering all required hardware, software and support materials. The Mercury+ PE1 base board is a complete development platform; detailed documentation and reference designs make it easy to get started, in addition to the user manual, schema, a 3D-model, PCB footprint and differential I/O length tables. The Enclustra Build Environment can be used to compile the Enclustra SoC modules with an integrated ARM processor very smoothly. The module and base board are selected by a graphical interface. After that, Enclustra Build Environment downloads the appropriate Bitstream, First Stage Boot Loader (FSBL) and the required source code. Finally, U-Boot, Linux and the root file system based on BusyBox are compiled. Thanks to the family concept with compatible connectors, different types of modules can be used on the same base board. If for example, an ARM processor is not required, the Mercury+ KX2 FPGA module can be used on the same baseboard instead.
New 0402-sized Ceramic Chip Inductors Provide Q Factors up to 162 at 2.4 GHz
Coilcraft's new 0402DC Series ceramic wirewound chip inductors offer the industry's highest Q factors in an 0402 (1005) size - up to 162 at 2.4 GHz - for super low loss in high frequency circuits. It is offered in 26 standard inductance values ranging from 3.0 to 120 nH. An additional 73 values are available upon request, including 0.1 nH increments from 2.8 nH to 10 nH. Most values are available with 2% tolerance. The 0402DC Series features a wirewound construction for extremely high self resonance - up to 16 GHz. It also offers DCR as low as 37 mΩ, significantly lower than other 0402-sized chip inductors. 0402DC Series chip inductors are ideal for impedance matching circuits for low band (700 - 960MHz) and high band (1710 - 2700MHz) antennas. Its 0402-sized package is perfect for smartphones and tablets. 0402DC Series inductors feature RoHS compliant, matte tin over nickel over silver-platinum-glass frit terminations and offer a maximum reflow temperature of 260°C. Like all Coilcraft products, complete technical specifications and free evaluation samples of the 0402DC Series are available at www.coilcraft.com. Parts are available from stock and can be ordered on-line at buy.coilcraft.com or by calling a local Coilcraft sales office.
Samtec’s New Edge Card Connectors for Higher Speeds and Proper Alignment
Samtec has expanded their line of edge card connectors with 0.80 mm and 1.00 mm pitch sockets designed for higher speed applications and optimal mating alignment. The 0.80 mm pitch socket (HSEC8-DP Series) is a differential pair version of Samtec’s popular Edge Rate® 0.80 mm pitch sockets. Rated for speeds to 28 Gbps NRZ/56 Gbps PAM4, the socket features Edge Rate® contacts designed to increase cycle life and decrease crosstalk. The double row socket, with 8 to 56 total pairs and optional rugged weld tabs, mates with standard 1.60 mm (.062") thick cards. Optimized for performance to 28 Gbps, the 1.00 mm pitch edge card socket (HSEC1 Series) also features signal integrity optimized Edge Rate® contacts with alignment pin and rugged weld tab options. The socket is available with up to 140 total positions and mates with standard 1.60 mm (.062") thick cards. For specific applications, this edge card socket can help mitigate misalignment in the X and Y axes to ensure optimal contact/pad connection. The smooth, broad, milled mating surface of the Edge Rate® contacts minimizes the effects of broadside coupling, which decrease crosstalk for superior signal integrity performance. Increased impedance control is achieved by a straight, more consistent material cross section. Robust when mating and unmating, this contact system also features a long contact wipe up to 1.5 mm, which improves the mating angle tolerance. In addition, Edge Rate® contacts are suitable for a variety of high-speed protocols and standards. “Samtec’s Edge Rate® brand is known in the industry as a versatile solution that enables the use of high-speed signals, while keeping mechanical integrity at a premium,” said Terry Emerson, Micro Rugged Project Manager at Samtec, Inc. “We’re excited to continue the mantra of the Edge Rate® brand with the addition of these two products.” Samtec’s full line of high-speed edge card connectors is available in a variety of pitches and orientations. The popular 0.80 mm pitch Edge Rate® sockets (HSEC8 Series) are available in vertical, pass-through, right-angle or edge mount orientations, and elevated stack heights to 30 mm. A micro 0.50 mm pitch socket (MEC5 Series) features a justification beam that enables the use of standard PCB tolerance and is PCIe® Gen 4 compliant. Standard high-speed edge card sockets include: 0.635 mm (MEC6 Series), 0.80 mm (MEC8 Series), 1.00 mm (MEC1 Series), 1.27 mm (MECF Series) and 2.00 mm (MEC2 Series). The 1.00 mm pitch PCI Express® socket (PCIE Series) supports one, four, eight and sixteen links with a low-profile version (PCIE-LP Series) compatible to Gen 4 speeds. The 1.00 mm pitch micro plane socket (SAL1 Series) is SATALink™ compatible and mounts in pairs to accommodate various mating card thicknesses. Samtec’s Signal Integrity Group provides application support via its in-house Signal Integrity engineers for these edge card connectors and many other products. These highly qualified engineers help with full-channel analysis, high-data-rate simulations, application-specific design and development assistance, and advanced design support.
Increasing IoT value through open standards to be discussed in upcoming oneM2M webinar
The importance of open standards in advancing Internet of Things (IoT) applications that use Low Power Wide Area (LPWA) networks will be discussed during a webinar hosted by oneM2M. Dr. Omar Elloumi, of Nokia, Chair of the oneM2M Technical Plenary, and Regional Marcom Vice Chair Chris Meering, of Hewlett Packard Enterprise (HPE), will explore the key findings of Boost LPWA revenue through oneM2M, a white paper published by the global IoT standards initiative last month. Elloumi and Meering will highlight the challenges Communication Service Providers (CSPs) are facing as they look to make the most of their burgeoning IoT deployments. They will then examine how an open standards approach can increase cost-effectiveness, improve scalability and boost confidence that today’s IoT projects will be future-proof and provide value to the CSPs deploying them. “One of the main conclusions from the white paper was that CSPs need to find ways to create not just more revenue but also more profit from their LPWA connections and application enablement provides this opportunity,” said Elloumi. “To achieve this, oneM2M provides a single horizontal platform for all applications, breaking down silos that inhibit growth and allowing CSPs to move one level up in the IoT value chain. This most recent white paper presents the case for how this works for LPWA networks and how it will accelerate the mass deployment of the IoT.” The webinar will also look at the way in which open standards support the advancement of the IoT by introducing a horizontal approach to platform management, allowing CSPs to reduce OpEX and explore opportunities for service innovation. “The need for interoperability is what drives oneM2M’s architecture, which allows CSPs to work across vertical markets and develop a single horizontal platform for data sharing between applications,” said Meering. “By adhering to oneM2M’s approach, CSPs can open up a whole new world of revenue opportunities and gain true value from their deployments, whilst also reducing OpEX.” The oneM2M webinar “Boost LPWA revenue through oneM2M” takes place on Thursday, January 18 at 15:00 GMT. To register to attend, please visit: https://www.brighttalk.com/webcast/11949/298821